PCB AND BACKPLANE VALIDATION

PCB soldering LC interface

PCB soldering LC interface

A Leadless Chip Carrier (LCC) is an integrated circuit (IC) package that, as its name suggests, lacks traditional external leads. Instead, it utilizes contact pads or metallized half-holes on its sides or bottom for direct soldering onto a printed circuit board (PCB). The ADXL78/ADXL278/ADXL193 are low cost, complete single-axis or dual-axis accelerometers that can measure both static acceleration like tilt or gravity and dynamic acceleration like shock and vibration. They are available in an ultrasmall ceramic leadless chip carrier package (LCC-8). This guide covers what PCB soldering is, introduces the primary soldering methods, outlines solder and tool selection, and provides clear, step-by-step. Precise process development and designed experimentation are needed to optimize specific appli-cation/performance. As part of PCB assembly, there are different types of PCB solder used to mount components.

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Backplane Connector Testing

Backplane Connector Testing

How to review a high-speed backplane PCB before release, with clear boundaries for connector zones, stackup and transition cleanup, inspection access, THT versus press-fit routes, and staged validation handoff. OIF's CEI-224G family — spanning XSR (on-package), VSR (chip-to-module), MR (chip-to-chip), and LR (backplane / copper cable) — is the architectural anchor for 1. 6T Ethernet, PCIe Gen7, NVLink 6, UALink, CXL next-gen, and 448G roadmap demonstrations. Impairments introduced at the backplane from module loading must be verified at the system level usi g a calibrated measurement system. Assuring signal integrity (SI) at high data rates while minimizing cost is a major guideline when designing high-speed interconnects and backplanes incorporating the latest PCIe®, USB-C, Thunderbolt™, and other standards. Comprehensive Test Capabilities Amphenol BSI offers a comprehensive suite of testing options: Flying Probe/AOI Testing: Ideal for proto/small volume builds, this method ensures precision and reliability. ICT and Functional Testing: For high-volume production, we rigorously test to meet stringent.

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