ACADEMIC MATTERS SINGAPORE INSTITUTE OF TECHNOLOGY

Recommended Spectrometer for Foundry in Singapore

Recommended Spectrometer for Foundry in Singapore

The SPECTROLAB as well as the SPECTROMAXx can be employed depending on the specialization, the number of casting processes and the semi-finished and finished products being produced. This handheld XRF analyzer offers NDT testing for scrap sorting and verification of ferro alloys, circulation material analysis, and other materials for melt correction, and finished steel components We offer a range of thermal analysis instruments for the analysis of cast iron (melting. Spectrometers can be used for various applications, including optical emission spectrometry (OES). Optical spectroscopy is a technique that analyzes how light interacts with matter to reveal the spectral characteristics of a sample.

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Components of Fiber Optic Sensing Technology

Components of Fiber Optic Sensing Technology

Optical fibers can be used as sensors to measure, , and other quantities by modifying a fiber so that the quantity to be measured modulates the,,, or transit time of light in the fiber. Sensors that vary the intensity of light are the simplest, since only a simple source and detector are required. Distributed Temperature Sensing (DTS), Distributed Temperature and Strain Sensing (DTSS) and Distributed Acoustic Sensing (DAS) are all various types of fiber optic sensing technologies which use the physical properties of light as it travels along a fiber to detect changes in. Jose Miguel Lopez-Higuera: Handbook of Optical Fiber Sensing Technology, John Wiley & Sons, 2002. This article explores the different types of Fiber Optic Sensors, their working principles, and various applications. Optical fiber sensors (OFSs) have emerged as essential tools in the monitoring of physical, chemical, and bio-medical parameters in harsh situations due to their high sensitivity, electromagnetic interference (EMI) immunity, and long-term stability.

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Ranking of Core Enterprises in Silicon Photonics Technology

Ranking of Core Enterprises in Silicon Photonics Technology

The top 6 silicon photonics companies in 2026, including Cisco Systems, Intel, IBM, NeoPhotonics, Hamamatsu Photonics, and STMicroelectronics globally. As per the analysis by Expert Market Research, the market is expected to be driven by the surge in. The increasing need for high-speed data transport, as well as the need for energy-efficient solutions in data centers and AI, are the. 5D integrated onboard silicon photonics by data centers and rising demand for high bandwidth, high data transfer, and government initiative to move towards e-banking are driving the Silicon Photonics market growth. Companies in this sector create products using lasers, optics, and imaging systems for applications in fields like telecommunications, medical devices, and manufacturing.

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Welding technology for sheet metal distribution boxes

Welding technology for sheet metal distribution boxes

Spot Welding: Structurally sound but best suited for non-structural or lightly loaded connections. In the manufacturing process of metal distribution boxes, welding constitutes a critical stage following sheet metal cutting and bending. Below, we explore the sheet metal welding methods we use and explain what to expect from each one in terms of strength, appearance, cost, and manufacturability.

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Optoelectronic Fusion Bonding Technology

Optoelectronic Fusion Bonding Technology

Fusion or direct wafer bonding enables permanent connection via dielectric layers on each wafer surface used for engineered substrate or layer transfer such as backside illuminated CMOS image sensors. EVG's HI Competence Center is designed to help enable new products and applications driven by advances in system integration and packaging. Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing for face-to-face connection of wafers. Focusing on photonic integrated circuits (PICs), which are based on SOI fabrication infrastructure, heterogeneous integration of III-V materials, such as indium phosphide (InP), enables high performance devices at low cost and high volumes. Fusion bonding plays a pivotal role in enabling CFET and BSPDN structures in logic devices, as well as advanced 3D memory structures.

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